IP Library › Patent Application 61158223
Patent Application Provisional Small
App. No. 61/158,223 · Confirmation No. 2623

METHOD AND APPARATUS FOR RELEASING THIN-FILM SILICON SUBSTRATES

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2013-04-11 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2009-06-19 APP.FILE.REC Filing Receipt 3 View
2009-06-15 PEFR Applicant Response to Pre-Exam Formalities Notice 1 View
2009-06-15 WFEE Fee Worksheet (SB06) 2 View
2009-06-15 N417 Electronic Filing System Acknowledgment Receipt 2 View
2009-04-13 NTC.MISS.PRT Notice to File Missing Parts 2 View
2009-04-13 APP.FILE.REC Filing Receipt 3 View
2009-03-06 TR.PROV Provisional Cover Sheet (SB16) 3 View
2009-03-06 SPEC Specification 24 View
2009-03-06 ABST Abstract 1 View
2009-03-06 WFEE Fee Worksheet (SB06) 2 View
2009-03-06 N417 Electronic Filing System Acknowledgment Receipt 2 View
2009-03-06 DRW Drawings-only black and white line drawings 10 View
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Quick Facts
App. No.
61/158,223
Filed
2009-03-06