Patent Application
Provisional
App. No. 61/247,149
· Confirmation No. 1024
Method for Exposing Through-Base Wafer Vias For Fabrication of Stacked Devices
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2010-12-02 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2010-12-01 | PD.TO.AUTH |
Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office | 2 | View | |
| 2010-12-01 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2009-10-13 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2009-09-30 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2009-09-30 | SPEC |
Specification | 7 | View | |
| 2009-09-30 | CLM |
Claims | 1 | View | |
| 2009-09-30 | ABST |
Abstract | 1 | View | |
| 2009-09-30 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2009-09-30 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
James Henry
Mesa, AZ
Daniel Hernandez Castillo II
Laveen, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 23543
- Docket No.
- 07383Z USA
- Confirmation No.
- 1024
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 61/247,149
- Filed
- 2009-09-30
External Links