Patent Application
Provisional
App. No. 61/247,566
· Confirmation No. 1961
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2009-10-14 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2009-10-01 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2009-10-01 | SPEC |
Specification | 5 | View | |
| 2009-10-01 | CLM |
Claims | 1 | View | |
| 2009-10-01 | ABST |
Abstract | 1 | View | |
| 2009-10-01 | DRW |
Drawings-only black and white line drawings | 2 | View | |
| 2009-10-01 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2009-10-01 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Henry Descalzo Bathan
Singapore, SINGAPORE
Flynn Carson
Redwood City, CA
Zigmund Ramirez Camacho
Singapore, SINGAPORE
Emmanuel Espiritu
Singapore, SINGAPORE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-710P
- Confirmation No.
- 1961
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-08-18
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Quick Facts
- App. No.
- 61/247,566
- Filed
- 2009-10-01
External Links