Patent Application
Provisional
App. No. 61/299,066
· Confirmation No. 8067
METHOD AND APPARATUS FOR TRANSFERING DIE FROM A WAFER
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2010-02-16 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2010-01-28 | ADS |
Application Data Sheet | 4 | View | |
| 2010-01-28 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2010-01-28 | SPEC |
Specification | 10 | View | |
| 2010-01-28 | CLM |
Claims | 1 | View | |
| 2010-01-28 | ABST |
Abstract | 1 | View | |
| 2010-01-28 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2010-01-28 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2010-01-28 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Sean M. Adams
Rochester, NY
Koenraad Alexander Gieskes
Deposit, NY
Attorneys & Agents of Record
Prosecution
- Customer No.
- 5409
- Docket No.
- UNIV.6718-NY
- Confirmation No.
- 8067
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 61/299,066
- Filed
- 2010-01-28
External Links