Patent Application
Provisional
App. No. 61/299,702
· Confirmation No. 1567
DIAMOND SOI WITH THIN SILICON NITRIDE LAYER
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2010-02-17 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2010-01-29 | TR.PROV |
Provisional Cover Sheet (SB16) | 1 | View | |
| 2010-01-29 | SPEC |
Specification | 9 | View | |
| 2010-01-29 | CLM |
Claims | 2 | View | |
| 2010-01-29 | ABST |
Abstract | 1 | View | |
| 2010-01-29 | DRW |
Drawings-only black and white line drawings | 4 | View | |
| 2010-01-29 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2010-01-29 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
Rick C. JEROME
Indialnatic, FL
Francois Hebert
San Mateo, CA
Craig McLachlan
Melbourne Beach, FL
Kevin Hoopingarner
Palm Bay, FL
Attorneys & Agents of Record
Prosecution
- Customer No.
- 39878
- Docket No.
- 0008.6032 (SE-2731-TD)
- Confirmation No.
- 1567
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2013-10-02
from
D2AUDIO CORPORATION,
ELANTEC SEMICONDUCTOR, INC.,
INTERSIL AMERICAS INC.,
INTERSIL COMMUNICATIONS, INC.,
INTERSIL CORPORATION,
KENET, INC.,
PLANET ATE, INC.,
QUELLAN, INC.,
TECHWELL, INC.,
ZILKER LABS, INC.
SECURITY AGREEMENT
Recorded 2010-05-05
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Quick Facts
- App. No.
- 61/299,702
- Filed
- 2010-01-29
External Links