Patent Application
Provisional
App. No. 61/362,896
· Confirmation No. 6314
Method for Wafer Dicing and Composition Useful Thereof
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2017-06-02 | EBCC.AD |
Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update | 1 | View | |
| 2010-07-30 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2010-07-09 | SPEC |
Specification | 15 | View | |
| 2010-07-09 | CLM |
Claims | 18 | View | |
| 2010-07-09 | ABST |
Abstract | 1 | View | |
| 2010-07-09 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2010-07-09 | TR.PROV |
Provisional Cover Sheet (SB16) | 4 | View | |
| 2010-07-09 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2010-07-09 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Dnyanesh Chandrakant Tamboli
Breinigsville, PA
Rajkumar Ramamurthi
Cave Creek, AZ
David Barry Rennie
Bethlehem, PA
Madhukar Bhaskara Rao
Fogelsville, PA
Gautam Banerjee
Chandler, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 143749
- Docket No.
- 07458Z USA
- Confirmation No.
- 6314
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 61/362,896
- Filed
- 2010-07-09
External Links