IP Library › Patent Application 61598765
Patent Application Provisional
App. No. 61/598,765 · Confirmation No. 2272

Solid Via Pins for Electrical and Thermal Conductivity in Package Substrates or PCBS

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2012-03-05 APP.FILE.REC Filing Receipt 3 View
2012-02-14 TR.PROV Provisional Cover Sheet (SB16) 2 View
2012-02-14 SPEC Specification 6 View
2012-02-14 DRW.NONBW Drawings-other than black and white line drawings 3 View
2012-02-14 WFEE Fee Worksheet (SB06) 2 View
2012-02-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
2012-02-14 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
61/598,765
Filed
2012-02-14