IP Library › Patent Application 61622272
Patent Application Provisional Small
App. No. 61/622,272 · Confirmation No. 4456

WAFER BONDING AND RELATED METHODS AND APPARATUS

Provisional Application Expired
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 Code Description Pages PDF
2016-08-03 C.AD.PAIR Change of Address via Patent Application Information Retrieval (PAIR) 1 View
2012-06-26 APP.FILE.REC Filing Receipt 3 View
2012-06-24 PEFR Applicant Response to Pre-Exam Formalities Notice 2 View
2012-06-24 ADS Application Data Sheet 3 View
2012-06-24 WFEE Fee Worksheet (SB06) 1 View
2012-06-24 WFEE Fee Worksheet (SB06) 2 View
2012-06-24 N417 Electronic Filing System Acknowledgment Receipt 2 View
2012-06-24 TRAN.LET Transmittal Letter 1 View
2012-04-24 NTC.MISS.PRT Notice to File Missing Parts 2 View
2012-04-24 APP.FILE.REC Filing Receipt 3 View
2012-04-10 TR.PROV Provisional Cover Sheet (SB16) 2 View
2012-04-10 SPEC Specification 8 View
2012-04-10 CLM Claims 3 View
2012-04-10 DRW.NONBW Drawings-other than black and white line drawings 2 View
2012-04-10 ADS Application Data Sheet 2 View
2012-04-10 N417 Electronic Filing System Acknowledgment Receipt 2 View
2012-04-10 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
61/622,272
Filed
2012-04-10