Patent Application
Provisional
App. No. 61/625,289
· Confirmation No. 3411
THERMALLY CONDUCTIVE POLYMER COMPOSITION TO REDUCE MOLDING CYCLE TIME
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2012-05-03 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2012-04-17 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2012-04-17 | SPEC |
Specification | 12 | View | |
| 2012-04-17 | CLM |
Claims | 1 | View | |
| 2012-04-17 | ABST |
Abstract | 1 | View | |
| 2012-04-17 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2012-04-17 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
Chandrashekar Raman
North Royalton, OH
Wayne A. Earley
Westerville, OH
Attorneys & Agents of Record
Prosecution
- Customer No.
- 82159
- Docket No.
- 32219-00136
- Confirmation No.
- 3411
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 61/625,289
- Filed
- 2012-04-17
External Links