Patent Application
Provisional
App. No. 61/856,947
· Confirmation No. 8414
THROUGH SEMICONDUCTOR VIA STRUCTURE WITH REDUCED STRESS PROXIMITY EFFECT
Inventor:
Soogeun Lee
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2013-08-07 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2013-07-25 | OATH |
Oath or Declaration filed | 1 | View | |
| 2013-07-25 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2013-07-22 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2013-07-22 | SPEC |
Specification | 21 | View | |
| 2013-07-22 | CLM |
Claims | 5 | View | |
| 2013-07-22 | ABST |
Abstract | 1 | View | |
| 2013-07-22 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2013-07-22 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2013-07-22 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Soogeun Lee
Ottawa, CANADA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 116722
- Docket No.
- MD01395-US-PRV
- Confirmation No.
- 8414
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 61/856,947
- Filed
- 2013-07-22
External Links