Patent Application
Provisional
App. No. 62/002,348
· Confirmation No. 2794
Semiconductor Device Package Having Asymmetric Chip Mounting Area and Lead Widths
Applicant:
Infineon Technologies AG
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2014-06-12 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2014-05-23 | ADS |
Application Data Sheet | 7 | View | |
| 2014-05-23 | SPEC |
Specification | 14 | View | |
| 2014-05-23 | CLM |
Claims | 7 | View | |
| 2014-05-23 | ABST |
Abstract | 1 | View | |
| 2014-05-23 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2014-05-23 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2014-05-23 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
Alexander Komposch
Morgan Hill, CA
Herman Hugo
San Jose, CA
Soon Ing Chew
Milpitas, CA
Simon Ward
Morgan Hill, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 57579
- Docket No.
- 1012-0872 / 2014P50725 US
- Confirmation No.
- 2794
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/002,348
- Filed
- 2014-05-23
External Links