Patent Application
Provisional
App. No. 62/014,242
· Confirmation No. 1374
PHOTOPATTERNABLE SILICONES FOR WAFER LEVEL Z-AXIS THERMAL INTERPOSER
Applicant:
DOW CORNING CORPORATION
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2014-07-03 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2014-06-19 | ADS |
Application Data Sheet | 7 | View | |
| 2014-06-19 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2014-06-19 | SPEC |
Specification | 23 | View | |
| 2014-06-19 | CLM |
Claims | 5 | View | |
| 2014-06-19 | ABST |
Abstract | 1 | View | |
| 2014-06-19 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2014-06-19 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2014-06-19 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
RANJITH SAMUEL JOHN
MIDLAND, MI
HERMAN C. G. D. C. MEYNEN
LUBBEEK, BELGIUM
CRAIG ROLLIN YEAKLE
MIDLAND, MI
Attorneys & Agents of Record
Prosecution
- Customer No.
- 137
- Docket No.
- DC11892PSP1
- Confirmation No.
- 1374
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/014,242
- Filed
- 2014-06-19
External Links