Patent Application
Provisional
App. No. 62/190,687
· Confirmation No. 9258
Thin Recon Interposer Package Without TSV for Fine I/O Pitch Fan-Out
Inventors:
Sam Ziqun ZHAO, Sam Komarapalayam KARIKALAN, Edward L T LAW, Reza R KHAN, Pieter VORENKAMP
Applicant:
Broadcom Corporation
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2015-07-22 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2015-07-09 | TRAN.LET |
Transmittal Letter | 2 | View | |
| 2015-07-09 | TR.PROV |
Provisional Cover Sheet (SB16) | 2 | View | |
| 2015-07-09 | 136A |
Authorization for Extension of Time all replies | 1 | View | |
| 2015-07-09 | ADS |
Application Data Sheet | 7 | View | |
| 2015-07-09 | SPEC |
Specification | 22 | View | |
| 2015-07-09 | CLM |
Claims | 3 | View | |
| 2015-07-09 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2015-07-09 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Sam Ziqun ZHAO
Irvine, CA
Sam Komarapalayam KARIKALAN
Irvine, CA
Edward L T LAW
Ladera Ranch, CA
Reza R KHAN
Irvine, CA
Pieter VORENKAMP
Laguna Niguel, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 49579
- Docket No.
- 3875.9700000
- Confirmation No.
- 9258
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/190,687
- Filed
- 2015-07-09
External Links