Patent Application
Provisional
App. No. 62/199,575
· Confirmation No. 6298
Connection Patterns for High-Density Device Packaging
Inventor:
Arun Ramakrishnan
Applicant:
Broadcom Corporation
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2015-08-14 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2015-07-31 | ADS |
Application Data Sheet | 6 | View | |
| 2015-07-31 | SPEC |
Specification | 7 | View | |
| 2015-07-31 | CLM |
Claims | 4 | View | |
| 2015-07-31 | ABST |
Abstract | 1 | View | |
| 2015-07-31 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2015-07-31 | TR.PROV |
Provisional Cover Sheet (SB16) | 1 | View | |
| 2015-07-31 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2015-07-31 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Arun Ramakrishnan
Irvine, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 16378
- Docket No.
- 14528.01084
- Confirmation No.
- 6298
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/199,575
- Filed
- 2015-07-31
External Links