IP Library › Patent Application 62324258
Patent Application Provisional
App. No. 62/324,258 · Confirmation No. 1096

WAFER LEVEL SYSTEM IN PACKAGE (SiP) USING A RECONSTITUTED WAFER

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2016-05-04 APP.FILE.REC Filing Receipt 3 View
2016-04-18 TR.PROV Provisional Cover Sheet (SB16) 2 View
2016-04-18 SPEC Specification 17 View
2016-04-18 CLM Claims 4 View
2016-04-18 ABST Abstract 1 View
2016-04-18 DRW Drawings-only black and white line drawings 8 View
2016-04-18 ADS Application Data Sheet 8 View
2016-04-18 WFEE Fee Worksheet (SB06) 2 View
2016-04-18 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
62/324,258
Filed
2016-04-18