Patent Application
Provisional
App. No. 62/398,316
· Confirmation No. 2577
COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS
Inventors:
Thomas B. Richardson, Kyle Whitten, Vincent Paneccasio JR., John Commander, Richard Hurtubise
Applicant:
MACDERMID ENTHONE INC.
Provisional Application Expired
|
⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2016-10-06 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2016-09-22 | SPEC |
Specification | 51 | View | |
| 2016-09-22 | CLM |
Claims | 23 | View | |
| 2016-09-22 | ADS |
Application Data Sheet | 9 | View | |
| 2016-09-22 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2016-09-22 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Thomas B. Richardson
Killingworth, CT
Kyle Whitten
Hamden, CT
Vincent Paneccasio JR.
Madison, CT
John Commander
Old Saybrook, CT
Richard Hurtubise
Clinton, CT
Attorneys & Agents of Record
Prosecution
- Customer No.
- 321
- Docket No.
- CEDE 2447
- Confirmation No.
- 2577
Child
PCT
Claims priority from a provisional application
→
PCT/US2017/052449
Filed 2017-09-20
· PCT - International Search Report Mailed to IB
Child
Claims priority from a provisional application
→
App. 16/334,098
· US 11,124,888
Filed 2019-03-18
· Patented Case
Child
Claims priority from a provisional application
→
App. 17/400,633
· US 11,697,884
Filed 2021-08-12
· Patented Case
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/398,316
- Filed
- 2016-09-22
External Links