Patent Application
Provisional
App. No. 62/549,733
· Confirmation No. 1080
Development of Industry Smallest and Thinnest Package in Molded Wafer Level Packaging (mWLP)
Applicant:
Semiconductor Components Industries, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2017-09-22 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2017-08-24 | ADS |
Application Data Sheet | 7 | View | |
| 2017-08-24 | SPEC |
Specification | 18 | View | |
| 2017-08-24 | CLM |
Claims | 1 | View | |
| 2017-08-24 | SPEC |
Specification | 18 | View | |
| 2017-08-24 | CLM |
Claims | 1 | View | |
| 2017-08-24 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2017-08-24 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2017-08-24 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View | |
| 2017-08-24 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View |
Inventors
Eiji KUROSE
Oizumi-machi, JAPAN
Sw WANG
Seremban, MALAYSIA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ETF2017-20-G19L01US
- Confirmation No.
- 1080
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 046530, FRAME 0460
Recorded 2023-06-23
PATENT SECURITY AGREEMENT
Recorded 2018-07-11
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Quick Facts
- App. No.
- 62/549,733
- Filed
- 2017-08-24
External Links