Patent Application
Provisional
App. No. 62/716,480
· Confirmation No. 9837
Integrated Assemblies Comprising Vertically-Stacked Memory Array Decks and Folded Digit Line Connections
Applicant:
Micron Technology, Inc.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2018-09-12 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2018-08-09 | SPEC |
Specification | 17 | View | |
| 2018-08-09 | CLM |
Claims | 6 | View | |
| 2018-08-09 | ABST |
Abstract | 1 | View | |
| 2018-08-09 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2018-08-09 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2018-08-09 | ADS |
Application Data Sheet | 8 | View | |
| 2018-08-09 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2018-08-09 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Scott J. Derner
Boise, ID
Charles L. Ingalls
Meridian, ID
Attorneys & Agents of Record
Prosecution
- Customer No.
- 128753
- Docket No.
- MI22-6620
- Confirmation No.
- 9837
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/716,480
- Filed
- 2018-08-09
External Links