Patent Application
Provisional
App. No. 62/811,147
· Confirmation No. 3702
SEMICONDUCTOR PACKAGE WITH HEATSINK
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2019-03-11 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2019-02-27 | ADS |
Application Data Sheet | 9 | View | |
| 2019-02-27 | SPEC |
Specification | 38 | View | |
| 2019-02-27 | CLM |
Claims | 4 | View | |
| 2019-02-27 | ABST |
Abstract | 1 | View | |
| 2019-02-27 | DRW |
Drawings-only black and white line drawings | 16 | View | |
| 2019-02-27 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2019-02-27 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Maria Clemens Ypil QUINONES
Cebu City, PHILIPPINES
Elsie Agdon CABAHUG
Consolacion, PHILIPPINES
Jerome TEYSSEYRE
Scottsdale, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ONS03184L01(B)US
- Confirmation No.
- 3702
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/811,147
- Filed
- 2019-02-27
External Links