IP Library › Patent Application 62820985
Patent Application Provisional
App. No. 62/820,985 · Confirmation No. 9688

FAN-OUT WAFER LEVEL CHIP-SCALE PACKAGES AND METHODS OF MANUFACTURE

Inventor: Eiji KUROSE
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2019-03-28 APP.FILE.REC Filing Receipt 3 View
2019-03-20 ADS Application Data Sheet 8 View
2019-03-20 ABST Abstract 1 View
2019-03-20 CLM Claims 5 View
2019-03-20 SPEC Specification 21 View
2019-03-20 DRW Drawings-only black and white line drawings 17 View
2019-03-20 WFEE Fee Worksheet (SB06) 2 View
2019-03-20 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
62/820,985
Filed
2019-03-20