Patent Application
Provisional
App. No. 62/846,209
· Confirmation No. 5239
POWER MODULE HOUSING
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2019-05-16 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2019-05-10 | ADS |
Application Data Sheet | 9 | View | |
| 2019-05-10 | ABST |
Abstract | 1 | View | |
| 2019-05-10 | CLM |
Claims | 5 | View | |
| 2019-05-10 | SPEC |
Specification | 12 | View | |
| 2019-05-10 | DRW |
Drawings-only black and white line drawings | 10 | View | |
| 2019-05-10 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2019-05-10 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Jihwan KIM
Seoul, KOREA, REPUBLIC OF
Yushuang Yao
Shenzhen, CHINA
Bosung WON
Seoul, KOREA, REPUBLIC OF
Atapol PRAJUCKAMOL
Thanyaburi, THAILAND
Olaf ZSCHIESCHANG
Vaterstetten, GERMANY
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ONS03385L01US
- Confirmation No.
- 5239
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 050156, FRAME 0421
Recorded 2023-08-16
SECURITY INTEREST
Recorded 2019-08-23
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Quick Facts
- App. No.
- 62/846,209
- Filed
- 2019-05-10
External Links