IP Library › Patent Application 62887349
Patent Application Provisional
App. No. 62/887,349 · Confirmation No. 1070

FLIP CHIP FACE TO FACE DIE-STACKED INTEGRATED SILICON PHOTONIC OPTOELECTRONIC MODULE PACKAGING

Applicant: FINISAR CORPORATION
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2019-08-29 APP.FILE.REC Filing Receipt 3 View
2019-08-15 PA.. Power of Attorney 3 View
2019-08-15 SPEC Specification 31 View
2019-08-15 CLM Claims 4 View
2019-08-15 ABST Abstract 1 View
2019-08-15 WFEE Fee Worksheet (SB06) 2 View
2019-08-15 N417 Electronic Filing System Acknowledgment Receipt 3 View
2019-08-15 ADS Application Data Sheet 9 View
2019-08-15 DRW Drawings-only black and white line drawings 12 View
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Quick Facts
App. No.
62/887,349
Filed
2019-08-15