Patent Application
Provisional
App. No. 62/993,495
· Confirmation No. 8238
STRUCTURE AND METHOD FOR MULTI-LAYER, THIN DIE SINGULATION
Inventor:
Gordon M. GRIVNA
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2020-03-26 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2020-03-23 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View | |
| 2020-03-23 | ADS |
Application Data Sheet | 8 | View | |
| 2020-03-23 | SPEC |
Specification | 3 | View | |
| 2020-03-23 | CLM |
Claims | 4 | View | |
| 2020-03-23 | DRW |
Drawings-only black and white line drawings | 17 | View | |
| 2020-03-23 | DRW.NONBW |
Drawings-other than black and white line drawings | 17 | View | |
| 2020-03-23 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2020-03-23 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2020-03-23 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View |
Inventors
Gordon M. GRIVNA
Mesa, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 132239
- Docket No.
- ONS04020L01US
- Confirmation No.
- 8238
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 052656, FRAME 0842
Recorded 2023-06-23
SECURITY INTEREST
Recorded 2020-05-13
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Quick Facts
- App. No.
- 62/993,495
- Filed
- 2020-03-23
External Links