Patent Application
Provisional
App. No. 63/005,760
· Confirmation No. 3190
SYSTEMS AND METHODS FOR PACKAGING AN ACOUSTIC DEVICE IN AN INTEGRATED CIRCUIT (IC)
Applicant:
QUALCOMM Incorporated
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2020-04-16 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2020-04-06 | ADS |
Application Data Sheet | 9 | View | |
| 2020-04-06 | ABST |
Abstract | 1 | View | |
| 2020-04-06 | CLM |
Claims | 3 | View | |
| 2020-04-06 | SPEC |
Specification | 18 | View | |
| 2020-04-06 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2020-04-06 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2020-04-06 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Huan En Ku
Singapore, SINGAPORE
Joo Shan Yam
Singapore, SINGAPORE
Chee Kong Lee
Singapore, SINGAPORE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 115309
- Docket No.
- 203336P1/1173-666P
- Confirmation No.
- 3190
No recorded assignments were found for this patent.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 63/005,760
- Filed
- 2020-04-06
External Links