IP Library › Patent Application 63046906
Patent Application Provisional Small
App. No. 63/046,906 · Confirmation No. 3615

DESIGN AND ASSEMBLY PROCESSS OF A HERMETICALLY SEALED PHOTONIC PACKAGE COMPRISING A PHOTONIC INTEGRATED CIRCUIT AND SEMICONDUCTOR LASER AND OPTICAL AMPLIFIER

Inventor: Lei Wang
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2023-12-19 N572 Response - Re: Informal Power of Attorney (PTOL-308) 1 View
2023-12-14 TRAN.LET Transmittal Letter — View
2023-12-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-12-14 TRAN.LET Transmittal Letter 1 View
2023-12-14 PA.. Power of Attorney 2 View
2023-12-14 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2023-03-01 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2023-03-01 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2023-02-23 PA.. Power of Attorney 2 View
2023-02-23 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2023-02-23 N417 Electronic Filing System Acknowledgment Receipt 2 View
2020-07-08 APP.FILE.REC Filing Receipt 3 View
2020-07-01 PA.. Power of Attorney 2 View
2020-07-01 ADS Application Data Sheet 8 View
2020-07-01 WFEE Fee Worksheet (SB06) 2 View
2020-07-01 N417 Electronic Filing System Acknowledgment Receipt 3 View
2020-07-01 SPEC Specification 6 View
2020-07-01 CLM Claims 1 View
2020-07-01 DRW Drawings-only black and white line drawings 7 View
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Quick Facts
App. No.
63/046,906
Filed
2020-07-01