IP Library › Patent Application 63065191
Patent Application Provisional
App. No. 63/065,191 · Confirmation No. 8020

Wire Bonding For Semiconductor Devices

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2020-08-21 APP.FILE.REC Filing Receipt 3 View
2020-08-13 ADS Application Data Sheet 9 View
2020-08-13 TR.PROV Provisional Cover Sheet (SB16) 4 View
2020-08-13 SPEC Specification 14 View
2020-08-13 CLM Claims 3 View
2020-08-13 ABST Abstract 1 View
2020-08-13 DRW Drawings-only black and white line drawings 14 View
2020-08-13 WFEE Fee Worksheet (SB06) 2 View
2020-08-13 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
63/065,191
Filed
2020-08-13