IP Library › Patent Application 63215455
Patent Application Provisional Small
App. No. 63/215,455 · Confirmation No. 3490

Chip to Chip Interconnect beyond Sealring boundary

Inventor: Robert Wiser
Provisional Application Expired
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 Code Description Pages PDF
2021-07-06 APP.FILE.REC Filing Receipt 3 View
2021-06-26 WFEE Fee Worksheet (SB06) 2 View
2021-06-26 N417 Electronic Filing System Acknowledgment Receipt 2 View
2021-06-26 ADS Application Data Sheet 8 View
2021-06-26 SPEC Specification 16 View
2021-06-26 CLM Claims 3 View
2021-06-26 ABST Abstract 1 View
2021-06-26 DRW Drawings-only black and white line drawings 6 View
2021-06-26 OATH Oath or Declaration filed 1 View
2021-06-26 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
63/215,455
Filed
2021-06-26