IP Library › Patent Application 63260701
Patent Application Provisional
App. No. 63/260,701 · Confirmation No. 1053

MOLDED IMAGE SENSOR PACKAGE

Inventors: Weng-Jin WU, Yusheng LIN
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2021-09-09 APP.FILE.REC Filing Receipt 3 View
2021-08-30 N417 Electronic Filing System Acknowledgment Receipt 3 View
2021-08-30 SPEC Specification 12 View
2021-08-30 CLM Claims 1 View
2021-08-30 ADS Application Data Sheet 8 View
2021-08-30 N417.PYMT Electronic Fee Payment 2 View
2021-08-30 SPEC Specification 12 View
2021-08-30 CLM Claims 1 View
2021-08-30 SPEC Specification — View
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Quick Facts
App. No.
63/260,701
Filed
2021-08-30