IP Library › Patent Application 63330610
Patent Application Provisional
App. No. 63/330,610 · Confirmation No. 5467

3-Dimensional Integrated Circuit Structures and Circuits

Applicant: pSemi Corporation
Provisional Application Expired
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 Code Description Pages PDF
2024-05-18 R46C.REQ Request under 37CFR1.46(c) to correct, update, change applicant 2 View
2024-05-18 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-05-18 ADS Application Data Sheet 10 View
2024-05-18 R3.73 Assignee showing of ownership per 37 CFR 3.73 3 View
2022-10-14 APP.FILE.REC Filing Receipt 3 View
2022-10-11 CFILE Request for Corrected Filing Receipt 1 View
2022-10-11 ADS Application Data Sheet 10 View
2022-10-11 CFILE Request for Corrected Filing Receipt 2 View
2022-10-11 N417 Electronic Filing System Acknowledgment Receipt 2 View
2022-04-21 APP.FILE.REC Filing Receipt 3 View
2022-04-13 TR.PROV Provisional Cover Sheet (SB16) 4 View
2022-04-13 DRW Drawings-only black and white line drawings 20 View
2022-04-13 ADS Application Data Sheet 10 View
2022-04-13 WFEE Fee Worksheet (SB06) 2 View
2022-04-13 N417 Electronic Filing System Acknowledgment Receipt 3 View
2022-04-13 SPEC Specification 33 View
2022-04-13 CLM Claims 5 View
2022-04-13 ABST Abstract 1 View
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Quick Facts
App. No.
63/330,610
Filed
2022-04-13