IP Library › Patent Application 63365638
Patent Application Provisional
App. No. 63/365,638 · Confirmation No. 3557

INTERCONNECT STRUCTURES FOR IMPROVED LIGHT-EMITTING DIODE CHIP PERFORMANCE

Applicant: CreeLED, Inc.
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2022-06-07 APP.FILE.REC Filing Receipt 3 View
2022-06-01 PA.. Power of Attorney 2 View
2022-06-01 DRW.NONBW Drawings-other than black and white line drawings 6 View
2022-06-01 N417.PYMT Electronic Fee Payment 2 View
2022-06-01 SPEC Specification 26 View
2022-06-01 CLM Claims 2 View
2022-06-01 ABST Abstract 1 View
2022-06-01 ADS Application Data Sheet 10 View
2022-06-01 N417 Electronic Filing System Acknowledgment Receipt 3 View
2022-06-01 SPEC Specification — View
2022-06-01 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2022-06-01 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
63/365,638
Filed
2022-06-01