Patent Application
Provisional
App. No. 63/368,745
· Confirmation No. 9756
METHOD OF FORMING A PHOTOSENSITIVE MODULE INCLUDING A THROUGH SILICON VIA (TSV) STRUCTURE
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-07-26 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2022-07-18 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2022-07-18 | ADS |
Application Data Sheet | 9 | View | |
| 2022-07-18 | SPEC |
Specification | 5 | View | |
| 2022-07-18 | CLM |
Claims | 1 | View | |
| 2022-07-18 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2022-07-18 | SPEC |
Specification | 5 | View | |
| 2022-07-18 | CLM |
Claims | 1 | View | |
| 2022-07-18 | SPEC |
Specification | 5 | View | |
| 2022-07-18 | CLM |
Claims | 1 | View | |
| 2022-07-18 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View | |
| 2022-07-18 | SPEC |
Specification | — | View | |
| 2022-07-18 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View |
Inventors
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ONS04438L01US
- Confirmation No.
- 9756
Child
Claims priority from a provisional application
→
App. 18/350,445
· US 12,720,900
Filed 2023-07-11
· Patented Case
Child
Claims priority from a provisional application
→
App. 18/350,474
Filed 2023-07-11
· Final Rejection Mailed
Child
Claims priority from a provisional application
→
App. 19/766,757
Filed 2026-08-05
· Application Undergoing Preexam Processing
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/368,745
- Filed
- 2022-07-18
External Links