Patent Application
Provisional
App. No. 63/369,004
· Confirmation No. 9858
POWER MODULE SEMICONDUCTOR PACKAGE
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-07-28 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2022-07-21 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View | |
| 2022-07-21 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2022-07-21 | ADS |
Application Data Sheet | 9 | View | |
| 2022-07-21 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2022-07-21 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2022-07-21 | SPEC |
Specification | 8 | View | |
| 2022-07-21 | CLM |
Claims | 1 | View | |
| 2022-07-21 | SPEC |
Specification | 8 | View | |
| 2022-07-21 | CLM |
Claims | 1 | View | |
| 2022-07-21 | SPEC |
Specification | — | View | |
| 2022-07-21 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View |
Inventors
Jerome TEYSSEYRE
Scottsdale, AZ
Oseob JEON
Seoul, KOREA, REPUBLIC OF
Chee Hiong CHEW
Seremban, MALAYSIA
Seungwon IM
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 64296
- Docket No.
- ONS04671L01US
- Confirmation No.
- 9858
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/369,004
- Filed
- 2022-07-21
External Links