Patent Application
Provisional
App. No. 63/371,700
· Confirmation No. 9969
ROBUST SEALING METHOD FOR DIRECT LIQUID COOLING POWER MODULES
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-08-25 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2022-08-17 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2022-08-17 | ADS |
Application Data Sheet | 8 | View | |
| 2022-08-17 | APPENDIX |
Appendix to the specification | 12 | View | |
| 2022-08-17 | SPEC |
Specification | 11 | View | |
| 2022-08-17 | CLM |
Claims | 1 | View | |
| 2022-08-17 | DRW.NONBW |
Drawings-other than black and white line drawings | 12 | View | |
| 2022-08-17 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2022-08-17 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View | |
| 2022-08-17 | SPEC |
Specification | — | View | |
| 2022-08-17 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View |
Inventors
Roveendra PAUL
Dublin, CA
Hyungsoo KIM
Yongin-si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ONS04688L01US
- Confirmation No.
- 9969
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/371,700
- Filed
- 2022-08-17
External Links