Patent Application
Provisional
App. No. 63/378,628
· Confirmation No. 3104
MODULE STRUCTURE USING AN INTEGRATED SUBSTRATE
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-10-26 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2022-10-17 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2022-10-06 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2022-10-06 | ADS |
Application Data Sheet | 8 | View | |
| 2022-10-06 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2022-10-06 | SPEC |
Specification | 6 | View | |
| 2022-10-06 | CLM |
Claims | 1 | View |
Inventors
Dongwook KANG
Bucheon, KOREA, REPUBLIC OF
Oseob Jeon
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ONS04704L02US
- Confirmation No.
- 3104
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/378,628
- Filed
- 2022-10-06
External Links