Patent Application
Provisional
App. No. 63/383,932
· Confirmation No. 9753
MOLDED POWER MODULE PACKAGE
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-11-22 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2022-11-16 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View | |
| 2022-11-16 | SPEC |
Specification | — | View | |
| 2022-11-16 | ADS |
Application Data Sheet | 8 | View | |
| 2022-11-16 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2022-11-16 | DRW.NONBW |
Drawings-other than black and white line drawings | 11 | View | |
| 2022-11-16 | SPEC |
Specification | 10 | View | |
| 2022-11-16 | CLM |
Claims | 1 | View | |
| 2022-11-16 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2022-11-16 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View |
Inventors
Atapol PRAJUCKAMOL
Thanyaburi, THAILAND
Ch CHEW
SEREMBAN, MALAYSIA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 64296
- Docket No.
- ONS04721L01US
- Confirmation No.
- 9753
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/383,932
- Filed
- 2022-11-16
External Links