Patent Application
Provisional
App. No. 63/449,366
· Confirmation No. 1476
HYBRID MULTI-DIE QFP-QFN PACKAGE
Applicant:
STMicroelectronics International N.V.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2023-03-13 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2023-03-02 | PA.. |
Power of Attorney | 2 | View | |
| 2023-03-02 | SPEC |
Specification | 8 | View | |
| 2023-03-02 | CLM |
Claims | 6 | View | |
| 2023-03-02 | ABST |
Abstract | 1 | View | |
| 2023-03-02 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2023-03-02 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2023-03-02 | ADS |
Application Data Sheet | 8 | View | |
| 2023-03-02 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2023-03-02 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2023-03-02 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Shei Meng LOO
Singapore, SINGAPORE
Edsel DE JESUS
Sengkang, SINGAPORE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 117381
- Docket No.
- 22TPY0989US01/58940-02324
- Confirmation No.
- 1476
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/449,366
- Filed
- 2023-03-02
External Links