Patent Application
Provisional
App. No. 63/509,312
· Confirmation No. 2664
MULTI-AXIS LASER DRILLING FOR WAFER-LEVEL PACKAGING
Inventor:
Shei Meng LOO
Applicant:
STMicroelectronics International N.V.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2023-07-03 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2023-06-21 | APP.TEXT |
Application body structured text document | — | View | |
| 2023-06-21 | DRW |
Drawings-only black and white line drawings | — | View | |
| 2023-06-21 | SPEC |
Specification | — | View | |
| 2023-06-21 | CLM |
Claims | — | View | |
| 2023-06-21 | ABST |
Abstract | — | View | |
| 2023-06-21 | PA.. |
Power of Attorney | — | View | |
| 2023-06-21 | N417.PYMT |
Electronic Fee Payment | — | View | |
| 2023-06-21 | N417 |
Electronic Filing System Acknowledgment Receipt | — | View | |
| 2023-06-21 | ADS |
Application Data Sheet | — | View |
Inventors
Shei Meng LOO
Singapore, SINGAPORE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 190186
- Docket No.
- 072878/593571
- Confirmation No.
- 2664
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/509,312
- Filed
- 2023-06-21
External Links