Patent Application
Provisional
Small
App. No. 63/553,385
· Confirmation No. 5655
Semiconductor Devices Having Thick SiN Features and Methods of Fabrication
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2024-02-23 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2024-02-23 | WELCOME.LET |
Welcome Letter from USPTO Director and Deputy Director | 1 | View | |
| 2024-02-14 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2024-02-14 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2024-02-14 | TR.PROV |
Provisional Cover Sheet (SB16) | 4 | View | |
| 2024-02-14 | SPEC |
Specification | 36 | View |
Inventors
Nicholas M Fahrenkopf
Albany, NY
Gerald L Leake
Albany, NY
Lewis Carpenter
Albany, NY
Katrina Morgan
Albany, NY
Attorneys & Agents of Record
Prosecution
- Customer No.
- 169515
- Docket No.
- AIM-2291P01
- Confirmation No.
- 5655
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/553,385
- Filed
- 2024-02-14
External Links