IP Library Patent Application 63553852
Patent Application Provisional Small
App. No. 63/553,852 · Confirmation No. 5726

HIGH DENSITY MODULE WITH INTEGRATED EXPANDED BEAM OPTICAL CONNECTOR

Applicant: viaPhoton, Inc.
Provisional Application Expired
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Code Description Pages PDF
2024-10-07 OATH Oath or Declaration filed 9 View
2024-02-23 APP.FILE.REC Filing Receipt 3 View
2024-02-23 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2024-02-15 APPENDIX.SUPP Appendix to the specification View
2024-02-15 SPEC Specification View
2024-02-15 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-02-15 SPEC Specification 13 View
2024-02-15 CLM Claims 1 View
2024-02-15 ADS Application Data Sheet 9 View
2024-02-15 TR.PROV Provisional Cover Sheet (SB16) 4 View
2024-02-15 APPENDIX Appendix to the specification 9 View
2024-02-15 DRW Drawings-only black and white line drawings 7 View
2024-02-15 N417.PYMT Electronic Fee Payment 2 View
2024-02-15 APPENDIX Appendix to the specification 1 View
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Quick Facts
App. No.
63/553,852
Filed
2024-02-15