IP Library › Patent Application 63600367
Patent Application Provisional
App. No. 63/600,367 · Confirmation No. 1754

DIGITAL THREE DIMENSIONAL (3D) MEASUREMENT OF BONDLINE THICKNESS AND WIDTH DURING BLADE ASSEMBLY

Provisional Application Expired
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2024-11-20 APP.FILE.REC Filing Receipt 3 View
2024-11-18 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-11-18 ADS Application Data Sheet 5 View
2024-11-18 R46C.REQ Request under 37CFR1.46(c) to correct, update, change applicant 1 View
2024-11-18 CFILE Request for Corrected Filing Receipt 3 View
2024-11-18 CFILE Request for Corrected Filing Receipt 2 View
2024-10-04 OATH Oath or Declaration filed 8 View
2023-11-29 APP.FILE.REC Filing Receipt 3 View
2023-11-29 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2023-11-17 SPEC Specification — View
2023-11-17 N417 Electronic Filing System Acknowledgment Receipt 3 View
2023-11-17 TR.PROV Provisional Cover Sheet (SB16) 4 View
2023-11-17 DRW.NONBW Drawings-other than black and white line drawings 29 View
2023-11-17 ADS Application Data Sheet 9 View
2023-11-17 SPEC Specification 39 View
2023-11-17 CLM Claims 3 View
2023-11-17 ABST Abstract 1 View
2023-11-17 N417.PYMT Electronic Fee Payment 2 View
2023-11-17 DRW.SUPP Drawings-black and white line and/or other drawings — View
2023-11-17 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
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Quick Facts
App. No.
63/600,367
Filed
2023-11-17