Patent Application
Provisional
App. No. 63/663,856
· Confirmation No. 7514
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRUCTURES AND METHOD OF MAKING THE SAME
Applicant:
Sandisk Technologies, Inc.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2024-07-01 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2024-07-01 | WELCOME.LET |
Welcome Letter from USPTO Director and Deputy Director | 1 | View | |
| 2024-06-25 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2024-06-25 | ADS |
Application Data Sheet | 8 | View | |
| 2024-06-25 | DRW |
Drawings-only black and white line drawings | 95 | View | |
| 2024-06-25 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2024-06-25 | SPEC |
Specification | 84 | View | |
| 2024-06-25 | CLM |
Claims | 5 | View | |
| 2024-06-25 | ABST |
Abstract | 1 | View | |
| 2024-06-25 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View | |
| 2024-06-25 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View |
Inventors
Tomohiro KUBO
Yokkaichi, JAPAN
Koichi MATSUNO
Fremont, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 97299
- Docket No.
- 3590-1220P-CIP3
- Confirmation No.
- 7514
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/663,856
- Filed
- 2024-06-25
External Links