IP Library Patent Application 63785422
Patent Application Provisional
App. No. 63/785,422 · Confirmation No. 8556

Optical Multi-Chip Interconnect Bridge (OMIB) Interposer Assembly Process to Enable High-Density Photonic Interconnects for High-Performance Computing Applications

Applicant: Celestial AI Inc.
Provisional Application Expired
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Quick Facts
App. No.
63/785,422
Filed
2025-04-08