IP Library › Granted Patent US 575,313
Granted Patent S1
US 575,313 · App. 29/276,139 · Granted Aug 19, 2008

Build platform

Assignee: 3D Systems, Inc.
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Quick Facts
Patent No.
US 575,313
App. No.
29/276,139
Granted
Aug 19, 2008
Kind
S1
Claims (1)

The ornamental design for a build platform, as shown and described.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →
SECURITY INTEREST Recorded Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2007
From: HULL, CHARLES W.; SPERRY, CHARLES R.; SCOTT, SUZANNE M.; MCNAMARA, DENNIS F., JR; RITTENHOUR, JASON
To: 3D SYSTEMS, INC.
Reel/Frame 018946/0673 →