IP Library Granted Patent US 576,486
Granted Patent S1
US 576,486 · App. 29/296,346 · Granted Sep 9, 2008

Headphone cork packaging block

Assignees: Sony Corporation; Sony Electronics Inc.
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Quick Facts
Patent No.
US 576,486
App. No.
29/296,346
Granted
Sep 9, 2008
Kind
S1
Claims (1)

The ornamental design for the headphone cork packaging block, as shown and described.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Sep 27, 2010
From: REGIONS BANK
To: VICTOR EQUIPMENT COMPANY
Reel/Frame 025039/0418 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2007
From: KOZA, MICHELLE
To: SONY CORPORATION; SONY ELECTRONICS INC.
Reel/Frame 019981/0394 →