IP Library Granted Patent US 608,474
Granted Patent S1
US 608,474 · App. 29/336,925 · Granted Jan 19, 2010

Architectural panel with buri palm and reed

Assignee: 3Form, Inc
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Quick Facts
Patent No.
US 608,474
App. No.
29/336,925
Granted
Jan 19, 2010
Kind
S1
Claims (1)

The ornamental design for architectural panel with buri palm and reed, as shown and described.

Assignments (3)
MERGER Recorded May 7, 2014
From: 3FORM, INC.
To: 3FORM, LLC
Reel/Frame 032845/0412 →
CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION OF 3FORM, INC. TO BE UTAH, INSTEAD OF DELAWARE, AS INCORRECTLY LISTED IN THE ORIGINAL ASSIGNMENT PREVIOUSLY RECORDED ON REEL 022854 FRAME 0476. ASSIGNOR(S) HEREBY CONFIRMS THE STATE OF INCORPORATION OF 3FORM, INC. IS UTAH. Recorded May 7, 2010
From: METCALF, ELIZABETH EGAN; CANALES, JILL A
To: 3FORM, INC.
Reel/Frame 024354/0052 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2009
From: METCALF, ELIZABETH EGAN; CANALES, JILL A.
To: 3FORM, INC.
Reel/Frame 022854/0476 →