IP Library Granted Patent US 7,124,806
Granted Patent B1
US 7,124,806 · App. 10/016,624 · Granted Oct 24, 2006

Heat sink for enhanced heat dissipation

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Quick Facts
Patent No.
US 7,124,806
App. No.
10/016,624
Granted
Oct 24, 2006
Kind
B1
Abstract

A heat sink assembly includes a block formed of a thermally conductive material. For example, the thermally conductive material includes thermally conductive polymer. A heat conduit (e.g., a heat pipe) extends through a substantial portion of the block. In one example arrangement, airflow channels extend through portions of the block.

Claims (20)

1. A heat sink assembly comprising:

a heat conduit;

a block formed of a thermally conductive non-metallic material having a first thermal conductivity,

the heat conduit extending through a substantial portion of the block,

the heat conduit having a second thermal conductivity greater than the first thermal conductivity,

wherein the block has a first segment on one side of a portion of the heat conduit, and the block has a second segment on another side of the portion of the heat conduit,

the first segment having a first heat conduction distance to dissipate heat from the heat conduit, and the second segment having a second heat conduction distance to dissipate heat from the heat conduit; and

a second heat conduit extending through another substantial portion of the block,

wherein the block has a third segment on one side of a portion of the second heat conduit, and the block has a fourth segment on another side of the portion of the second heat conduit,

the third segment having a third heat conduction distance to dissipate heat from the second heat conduit, and the fourth segment having a fourth heat conduction distance to dissipate heat from the second heat conduit.

2. The heat sink assembly of claim 1 , wherein the first and second heat conduction distances are substantially the same.

3. The heat sink assembly of claim 1 , wherein each of the first, second, third, and fourth segments have airflow channels extending therethrough.

4. A system comprising:

a component; and

a heat sink thermally contacted to the component,

the heat sink having a block formed of a thermally conductive non-metallic material, the heat sink having a first segment and a second segment,

the heat sink further having a heat conduit extending through the block between the first and second segments, the first segment to transfer heat away from the heat conduit in a first direction, and the second segment to transfer heat away from the heat conduit in a second direction,

wherein the block further has a third segment and a fourth segment, the heat sink further having a second heat conduit extending between the third and fourth segments.

5. The system of claim 4 , wherein the thermally conductive material comprises thermally conductive polymer.

6. The system of claim 4 , wherein the heat conduits comprise heat pipes.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2007
From: NCR CORPORATION
To: TERADATA US, INC.
Reel/Frame 020540/0786 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2001
From: WANG, DAVID G.; MULLER, P. KEITH
To: NCR CORPORATION
Reel/Frame 012385/0623 →