IP Library › Granted Patent US 743,356
Granted Patent S1
US 743,356 · App. 29/441,960 · Granted Nov 17, 2015

Diamond-shaped semiconductor die

Inventors: Rajat Sharma (Fremont, CA); Andrew Felker (Fremont, CA); William D. Houck (Fremont, CA)
Assignee: Soraa, Inc.
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Quick Facts
Patent No.
US 743,356
App. No.
29/441,960
Granted
Nov 17, 2015
Kind
S1
Claims (1)

The ornamental design for a diamond-shaped semiconductor die, as shown and described.

Assignments (3)
NUNC PRO TUNC ASSIGNMENT Recorded Feb 21, 2022
From: ECOSENSE LIGHTING INC.
To: KORRUS, INC.
Reel/Frame 059239/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2020
From: SORAA, INC.
To: ECOSENSE LIGHTING, INC.
Reel/Frame 052725/0022 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2013
From: SHARMA, RAJAT; FELKER, ANDREW; HOUCK, WILLIAM D.
To: SORAA, INC.
Reel/Frame 029951/0565 →
Continuity (2)
Continuation 13357578 · Jan 24, 2012
Continuation In Part 13163482 · Jun 17, 2011