Radio frequency signal processing device
View Patent ↗The RF device of the present invention includes: a semiconductor substrate; and first and second semiconductor components provided on the substrate. Each of the components includes source electrodes, a gate electrode and a drain electrode. And multiple through holes, which pass through the substrate in the thickness direction, are opened in a region of the substrate between the two components. To enhance the effect of suppressing electrical interference between the components, a gap between two adjacent ones of the through holes is preferably smaller than the thickness of the substrate.
1. An RF device comprising:
a plurality of semiconductor elements formed on a semiconductor substrate composed of a semiconductor material;
a plurality of through holes which are provided between two adjacent ones of the plurality of semiconductor elements and pass from a surface through the backside of the semiconductor substrate,
wherein a distance between two adjacent ones of the plurality of through holes is smaller than a thickness of the semiconductor substrate so as to reduce power leaking between two adjacent ones of the plurality of semiconductor elements.
2. The device of claim 1 , wherein side faces of the plurality of through holes are covered with a conductive material.
3. The device of claim 2 , wherein the conductive material is electrically connected to a ground wiring layer provided on the surface of the backside of the semiconductor substrate.
4. The device of claim 1 , wherein the semiconductor substrate is a GaAs substrate.
5. An RF device comprising:
a plurality of semiconductor elements formed on a semiconductor substrate composed of a semiconductor material;
a first group of through holes which are provided between two adjacent ones of the plurality of semiconductor elements and pass from a surface through the backside of the semiconductor substrate and whose side faces are covered with a conductive material; and
a second group of through holes which are provided in electrodes of the plurality of semiconductor elements, pass from a surface through the backside of the semiconductor substrate, and whose side faces are covered with the conductive material,
wherein the conductive material which covers side faces of the first and second groups of through holes is electrically connected to a first wiring layer provided on the backside of the semiconductor substrate, and
a distance between two adjacent ones of the first group of through holes is smaller than a thickness of the semiconductor substrate so as to reduce power leaking between two adjacent ones of the plurality of semiconductor elements.
6. The device of claim 5 , wherein the semiconductor substrate is a GaAs substrate.
7. The RF device of claim 1 ,
wherein the distance between two adjacent ones of the plurality of through holes is smaller than a thickness of the semiconductor substrate so as to exponentially reduce power leaking between two adjacent ones of the plurality of semiconductor elements with regard to the distance between two adjacent ones of the plurality of through holes.
8. The RF device of claim 5 ,
wherein the distance between two adjacent ones of the first group of through holes is smaller than a thickness of the semiconductor substrate so as to exponentially reduce power leaking between two adjacent ones of the plurality of semiconductor elements with regard to the distance between two adjacent ones of the first group of through holes.
9. The RF device of claim 5 ,
wherein some through holes of the first group and some through holes of the second group are electrically connected to the first wiring layer, and
some of the other through holes of the first group and some of the other through holes of the second group are electrically connected to a second wiring layer.
10. The RE device of claim 9 ,
wherein a grounded wiring layer is formed on a printed circuit board, and
the first and second wiring layers are electrically connected to the grounded wiring layer.
11. The RF device of claim 10 ,
wherein a third wiring layer other than the grounded wiring layer is formed on the printed circuit board, and
one of the through holes of the second group is electrically connected to the third wiring layer.