IP Library Granted Patent US 7,648,821
Granted Patent B2
US 7,648,821 · App. 11/911,825 · Granted Jan 19, 2010

Method of forming flexible electronic circuits

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Quick Facts
Patent No.
US 7,648,821
App. No.
11/911,825
Granted
Jan 19, 2010
Kind
B2
Abstract

A multiple layer photosensitive element having at least three differently sensitised photosensitive layers on one side of a support, such as a, transparent flexible support, is imagewise exposed according to a desired circuit pattern and developed to form two layers of conductive track patterns from each photosensitive layer, which may then be connected together by forming vias by drilling or in situ generation. The resulting multiple layer conductive element has application in the field of printed circuit board manufacture or as the backplane electronic element of a flexible display device.

Claims (23)

1. A method of manufacturing a multiple layer conductive element, said conductive element having three or more layers of electrically conductive material, each layer of said conductive material being conductive according to a desired pattern, said method comprising the steps of providing a photosensitive element comprising:

a support having coated on at least one side thereof a first photosensitive layer sensitive to radiation of a first spectral region;

a second photosensitive layer sensitive to radiation of a second spectral region, said second photosensitive layer being located respectively further away from said support than said first photosensitive layer; and

a photosensitive intermediate layer located between said first and second photosensitive layers, said photosensitive intermediate layer being sensitive to radiation of a third spectral region being different from that of said first and second spectral regions and said layer containing at least one of a polymer latex, polymer beads and/or dielectric particles,

said photosensitive intermediate layer and said first and second photosensitive layers being capable of, upon imagewise exposure according to a desired pattern and development, providing a metal image according to said desired pattern;

imagewise exposing each of said photosensitive layers and said photosensitive intermediate layer of said photosensitive element with radiation of an appropriate wavelength according to respective desired conductive patterns for each of said photosensitive layers to form a latent image in each of said photosensitive layers; and

developing said photosensitive element to form a conductive metal pattern corresponding to the pattern of each latent image.

2. The method of claim 1 , wherein said first photosensitive layer is sensitised to a different spectral region from that of said second photosensitive layer.

3. The method of claim 1 , wherein said photosensitive intermediate layer is exposed to a pattern of connective posts to provide for electrical connection between the desired conductive patterns of said first and second photosensitive layers.

4. The method of claim 1 , wherein said first and second photosensitive layers we also sensitive to radiation in the spectral region to which said photosensitive intermediate layer is exposed.

5. The method of claim 1 , wherein said first photosensitive layer, said second photosensitive layer and said photosensitive intermediate layer comprise photosensitive silver halide in a polymer material, whereby exposure and development according to the desired pattern forms conductive silver tracks according to said desired pattern.

6. A multiple layer conductive element obtainable by the method of claim 1 .

7. A photosensitive element comprising:

a support having coated on at least one side thereof a first photosensitive layer sensitive to radiation of a first spectral region;

a second photosensitive layer sensitive to radiation of a second spectral region, said second photosensitive layer being located respectively further away from said support than said first photosensitive layer; and

a photosensitive intermediate layer located between said first and second photosensitive layers, said photosensitive intermediate layer being sensitive to radiation of a third spectral region being different from that of said first and second spectral regions and said layer containing at least one of a polymer latex, polymer beads and/or dielectric particles,

said photosensitive intermediate layer and said first and second photosensitive layers being capable of, upon imagewise exposure according to respective desired patterns and development, providing conductive metal images according to said desired patterns.

8. The element of claim 7 , wherein said first photosensitive layer is sensitised to a different spectral region from that of said second photosensitive layer.

9. The element of claim 7 , wherein said first photosensitive layer, said second photosensitive layer and said photosensitive intermediate layer comprise photosensitive silver halide in a polymer material, whereby exposure and development according to the desired pattern forms conductive silver tracks according to said desired pattern.

10. The element of claim 9 , wherein said polymer material is gelatin and the silver to gelatin ratio by weight is at least 1:2.

11. The element of claim 7 , wherein said intermediate layer comprises additives to improve the insulating properties of said intermediate layer.

12. The element of claim 7 wherein said intermediate layer comprises polymethacrylate matte beads.

13. The element of claim 12 wherein the matte beads are smaller than 3 μm.

Assignments (13)
NOTICE OF SECURITY INTERESTS Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 056984/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0233 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056733/0681 →
RELEASE OF SECURITY INTEREST Recorded Jan 24, 2020
From: BARCLAYS BANK PLC
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST) INC.; KODAK AMERICAS LTD.; KODAK REALTY INC.; LASER PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES LTD.; NPEC INC.
Reel/Frame 052773/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049814/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (SECOND LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 031159/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (ABL) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
To: BANK OF AMERICA N.A., AS AGENT
Reel/Frame 031162/0117 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (FIRST LIEN) Recorded Sep 5, 2013
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC; KODAK AMERICAS, LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE
Reel/Frame 031158/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 5, 2013
From: CITICORP NORTH AMERICA, INC., AS SENIOR DIP AGENT; WILMINGTON TRUST, NATIONAL ASSOCIATION, AS JUNIOR DIP AGENT
To: EASTMAN KODAK COMPANY; PAKON, INC.
Reel/Frame 031157/0451 →
PATENT SECURITY AGREEMENT Recorded Apr 1, 2013
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 030122/0235 →
SECURITY INTEREST Recorded Feb 21, 2012
From: EASTMAN KODAK COMPANY; PAKON, INC.
To: CITICORP NORTH AMERICA, INC., AS AGENT
Reel/Frame 028201/0420 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2007
From: SLATER, SEAN D.; FYSON, JOHN R.; RIDER, CHRISTOPHER B.; CLARKE, DAVID T.; WINKEL, JURJEN F.; HEWITSON, PETER
To: EASTMAN KODAK COMPANY
Reel/Frame 019979/0266 →