Granted Patent B2

US 7,755,313 · App. 11/853,862 · Granted Jul 13, 2010

Abstract

Claims (46)

1. A method comprising:

generating a maximum allowable current I* S(max) for a motor based on a temperature difference between a temperature reference T* of a power inverter module and a semiconductor device temperature T of the power inverter module;

generating a maximum allowable torque T* e(max) based on the maximum allowable current I* S(max) and a maximum allowable flux Ψ* S(max) ; and

using the maximum allowable torque T* e(max) to limit a torque command T e * in order to suppress the semiconductor device temperature T to below the temperature reference T*.

2. The method of claim 1 , wherein generating the maximum allowable current I* S(max) comprises calculating the semiconductor device temperature T of the power inverter module.

3. The method of claim 2 , wherein calculating the semiconductor device temperature T of the power inverter module comprises estimating a junction temperature T j of the power inverter module using at least a coolant temperature T c of the power inverter module.

4. The method of claim 3 , wherein calculating the semiconductor device temperature T of the power inverter module further comprises estimating the junction temperature T j using a total power dissipation P d of the power inverter module.

5. The method of claim 1 , wherein generating the maximum allowable current I* S(max) comprises measuring the semiconductor device temperature T of the power inverter module.

6. The method of claim 5 , wherein measuring the semiconductor device temperature T of the power inverter module comprises:

measuring the junction temperature T j of the power inverter module; and

controlling the junction temperature T j of the power inverter module by adjusting a self dissipation P dQ of a transistor of the power inverter module and by adjusting a total power dissipation P d of the power inverter module.

7. The method of claim 5 , wherein measuring the semiconductor device temperature T of the power inverter module comprises measuring a substrate temperature T s of the power inverter module.

8. A controller operable to limit a temperature of a power inverter module in an automotive system, the controller comprising:

a temperature error circuit operable to provide a difference between a temperature reference for the power inverter module and a temperature of the power inverter module at an output of the temperature error circuit; and

a Proportional Integrator (PI) controller circuit coupled to the output of the temperature error circuit, the PI controller circuit operable to provide a current reference I s(fb) based at least in part upon the difference, wherein the PI controller circuit has a transfer function C(s) that is substantially expressed as

C

⁡

(

s

)

=

k

p

+

k

i

s

,

where and k p and k i comprise gains of the PI controller circuit.

9. The controller of claim 8 , the temperature of the power inverter module comprising a measured temperature of the power inverter module.

10. The controller of claim 9 , the measured temperature of the power inverter module comprising a measured temperature of a junction of the power inverter module.

11. The controller of claim 8 , the temperature of the power inverter module comprising an estimated temperature of the power inverter module.

12. The controller of claim 11 , the estimated temperature of the power inverter module comprising an estimated substrate temperature of the power inverter module.

13. The controller of claim 8 , further comprising a feedforward circuit coupled to an output of the PI controller circuit, the feedforward circuit operable to output an initial maximum allowable current I** S(max) based on the addition of a feedforward current term I S(ff) to the current reference I S(fb) .

14. The controller of claim 13 , further comprising a limiting circuit coupled to an output of the feedforward circuit, the limiting circuit operable to output the maximum allowable current I* S(max) by limiting the initial maximum allowable current I** S(max) based on a maximum or a minimum that is required for operation of the automotive system.

15. The controller of claim 14 , further comprising a discrepancy collection circuit coupled to an output of the feedforward circuit, an output of the limiting circuit, and to an input of the PI controller circuit, the discrepancy collection circuit operable to calculate a difference between the maximum allowable current I* S(max) and the initial maximum allowable current I** S(max) , then reduce the difference by a factor of 1/k p , where k p comprises a gain of the PI controller circuit.

16. An automotive system comprising:

a motor;

a power inverter module coupled to the motor;

a controller coupled to the motor, the controller operable to generate a maximum allowable current I* S(max) for the motor based on a difference between a temperature limit T* for the power inverter module and a semiconductor device temperature T of the power inverter module; and

a torque limiter coupled to the controller, the torque limiter operable to:

generate a maximum allowable torque T* e(max) based on the maximum allowable current I* S(max) and a maximum allowable flux Ψ* S(max) ; and

limit a torque command for the motor using the maximum allowable torque T* e(max) in order to suppress the semiconductor device temperature T to below the temperature reference T*.

17. The automotive system of claim 16 , wherein the temperature limit T* for the power inverter module comprises a junction temperature limit T* j and the semiconductor device temperature T of the power inverter module comprises an estimated junction temperature {circumflex over (T)} j .

18. The automotive system of claim 16 , wherein the temperature limit T* for the power inverter module comprises a junction temperature limit T* j and the semiconductor device temperature T of the power inverter module comprises a measured junction temperature T j .

19. The automotive system of claim 16 , wherein the temperature limit T* for the power inverter module comprises a substrate temperature limit T* s and the semiconductor device temperature T of the power inverter module comprises a substrate temperature T s .

Assignments (13)